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Surface Finishing Chemicals
- Technical Documentation
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- Electroless Ni/Pd/Au plating process (Reduction Pd type)
- Electroless Ni/Pd/Au plating process (Substitution Pd type)
- Heat-resistant copper anti-tarnish agent (AT-4)
- Adhesion promoter (PA-2)
- Anti-EBO (epoxy bleed out) agent (TG-4R)
- Copper anti-scorch agent (OR-2)
- Metal surface treatment agent (CT-3)
- Surface treatment agent for power devices (CT-3S)
- Improved adhesion between nickel and resin (roughened nickel plating, CT-5A)
- Rhodium sulfate plating
Recycling
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Cleaner
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ECU - Printed board
- Fabricated Metal Products
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Display
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Camera Module
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- Surface Finishing Chemicals
Connector
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- Surface Finishing Chemicals
Heat Radiation
- Fabricated Metal Products
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- Surface Finishing Chemicals
ECU - Semiconductor
- Chemical Products
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- Surface Finishing Chemicals
LiB
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