| KG-510 |
Alkali degreasing |
Removes adhesive and resist residue. |
| KG-511 |
Acid degreasing |
Removes adhesive and resist residue. |
| KG-512 |
Acid degreasing |
Reduces damage to the resist. |
| KG-528 |
Activator |
Sulfuric acid type, low concentration of Pd. |
| KG-529 |
Activator |
Low hydrochloric acid type, for fine line patterns (bridging prevention) and a long life. |
| KG-531 |
Soft electroless Ni-P plating solution for flexible PCBs |
Medium phosphorus type (6 to 8%), excellent flex resistance |
| KG-535 |
Electroless Ni-P plating solution for rigid PCBs |
Medium-high phosphorus type (8 to 10%), excellent corrosion resistance |
| KG-536 |
Soft electroless Ni-P plating solution for flexible PCBs |
Medium-high phosphorus type (8 to 10%), excellent flex and corrosion resistance |
| KG-537 |
Soft electroless Ni-P plating solution for flexible PCBs |
Medium phosphorus type (6 to 8%), Pb-free, excellent flex resistance |
| KG-110N |
Electroless Pd plating solution |
Displacement type, long life, excellent bath stability |
| KG-110NSJ |
Electroless Pd plating solution |
Displacement-reduction type, Pd-P alloy, excellent bath stability |
| KG-543 |
Electroless Pd plating solution |
Displacement-reduction type, pitting-free Displacement-reduction type, pitting-free, no added cyanide, small variation in Au film thickness |
| KG-545 |
Electroless Pd plating solution |
Displacement type, fast deposition rate |
| KG-545Y |
Electroless Pd plating solution |
Displacement type, reduced pitting |
