Electroless Plating Chemicals for PWB/FPC
Electroless plating chemicals for PWB/FPC
| Product name | Application | Features |
|---|---|---|
| KG-510 | Alkali degreasing | Removes adhesive and resist residue. |
| KG-511 | Acid degreasing | Removes adhesive and resist residue. |
| KG-512 | Acid degreasing | Reduces damage to the resist. |
| KG-528 | Activator | Sulfuric acid type, low concentration of Pd. |
| KG-529 | Activator | Low hydrochloric acid type, for fine line patterns (bridging prevention) and a long life. |
| KG-531 | Soft electroless Ni-P plating solution for flexible PCBs | Medium phosphorus type (6 to 8%), excellent flex resistance |
| KG-535 | Electroless Ni-P plating solution for rigid PCBs | Medium-high phosphorus type (8 to 10%), excellent corrosion resistance |
| KG-536 | Soft electroless Ni-P plating solution for flexible PCBs | Medium-high phosphorus type (8 to 10%), excellent flex and corrosion resistance |
| KG-537 | Soft electroless Ni-P plating solution for flexible PCBs | Medium phosphorus type (6 to 8%), Pb-free, excellent flex resistance |
| KG-110N | Electroless Pd plating solution | Displacement type, long life, excellent bath stability |
| KG-110NSJ | Electroless Pd plating solution | Displacement-reduction type, Pd-P alloy, excellent bath stability |
| KG-543 | Electroless Pd plating solution | Displacement-reduction type, pitting-free Displacement-reduction type, pitting-free, no added cyanide, small variation in Au film thickness |
| KG-545 | Electroless Pd plating solution | Displacement type, fast deposition rate |
| KG-545Y | Electroless Pd plating solution | Displacement type, reduced pitting |
Post-treatment chemicals for PCBs
| Product name | Application | Features |
|---|---|---|
| KG-210 | Post- treatment agents of ENIG, ENIPIG and ENEPIG | Water soluble, anti-oxidation |
| KG-230 | Post- treatment agents of ENIG | Water soluble, salt spray resistant |
| TG-3M | Anti-oxidation for Sn and Sn alloys | Strong acidity, prevents oxidation (discoloration) during heat treatment, non-foaming |
Primary rust prevention chemicals for CCL, FCCL
| Product name | Application | Features |
|---|---|---|
| OP-1 | Primary rust prevention for PCB copper traces | Copper rust prevention during storage |
| OP-10 | Primary rust prevention for PCB copper traces | Copper anti-scorch agent, suitable for preventing copper oxidation at high temperatures |
| OP-11 | Primary rust prevention for PCB copper traces, phosphorus-free | Copper anti-scorch agent, suitable for preventing copper oxidation at high temperatures Heat-resistant copper anti-tarnish agent, complies with phosphorus wastewater regulations |
| CR-1 | Primary rust prevention for PCB copper traces | Copper rust prevention during storage, possible to process removal of copper oxide film and treatment of rust prevention at the same time |
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