Lead Frame Chemicals
Lead Frame Chemicals
| Product name | Application | Features |
|---|---|---|
| AT-2 | Inhibitor for peeling copper oxide film | High heat resistance, high oxide resistant film peeling prevention agent (silver added) |
| AT-4 | Inhibitor for peeling copper oxide film | Heat resistance, high oxide resistant film peeling prevention agent (No silver added) |
| AT-7 | Inhibitor for peeling copper oxide film | Equivalent to the features of AT-4, achieving high cost performance |
| HK-2000 | Copper anti-tarnish agent | High anti-tarnish performance, highly water-repellent |
| IS-1 | Multifunctional copper anti-tarnish agent | Inhibitor for peeling copper oxide film + improved resin adhesion |
| PA-2 | Metal/resin adhesion promoter | Silane coupling agent, promotes adhesion between various metals and resins |
| TF-1 | 1 liquid 2 function agent | Inhibitor for peeling copper oxide film, anti-EBO |
| OR-2 | Copper anti-scorch agent | Suppressing change of color tone on copper by heating |
| BA-1 | EBO agent for spot Ag plating (silver surface only) | Selective adsorption on silver surface, non-fluorine, non-sulfur |
| BA-2 | EBO agent for spot Ag plating (silver surface only) | Selective adsorption on silver surface, non-fluorine, non-sulfur, highly water-repellent, high-foaming |
| BA-9H | Anti-EBO agent (for all metals) | For all metals, non-fluorine, non-sulfur |
| TG-4R | Anti-EBO agent (for all metals) | For all metals, can be used in low concentrations, good water repellency |
- ※めっき膜厚 Cu：～0.3μm, Ag：～5μm, Ni：～1μm, Pd：～0.03μm, Au：～0.01μm
- ※EBO：Epoxy Bleed Out
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