Electroless Ni/Pd/Au plating process (Reduction Pd type)
Features
Extremely stable deposition rate.
The new Pd plating bath has excellent solution stability while maintaining a high deposition rate.
- *MTO (Metal Turn Over): The number of times the Pd metal is replenished to compensate for the amount consumed by deposition.
Excellent solderability and wire bondability.
Solderability
The PCB is passed through a reflow oven four times for preheating before the solder balls are attached.
- Solder balls
- Sn-2Ag-Cu-Ni
- Ball diameter
- φ0.4 mm
- Pad diameter
- φ0.35 mm
- Flux
- 30%Rosin (R type)
- Equipment
- Dage-4000HS
- Shear speed
- 1000 mm/s
- Shear height
- 100 μm
Wire bondability
Main applications
- IC package substrates
- LED substrates
- Printed wiring boards
Please contact us for details.
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