Surface treatment agent for power devices (CT-3S)
Features
- Anti-oxidation treatment for Ni (/Cu) heat sinks allows flux-free soldering
- Possible to use as water-remover agent owing to strong water repellency against Ni
Anti-oxidation property against Ni
- Base material
- Pure Cu plate/glossy Ni (2 μm)
- Test method
- Zero cross time method
Sn-3Ag-0.5Cu, 280°C, immersion speed: 5 mm/s, depth: 5 mm, time: 10 s
Main applications
- IGBT heat sink
- Ni plating products in general
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