Precious Metal Plating Chemicals (Au,Ag,Rh,Ru)
Precious metal plating chemicals
Product name | Application | Features |
---|---|---|
H-8 (rhodium sulfate plating solution) | Contact parts, semiconductors (MEMS) | Maintains compressive stress, possible to make ultra-thick plating over tens micron |
F-9 (rhodium sulfate plating solution) | Decorative, contact parts, semiconductors (MEMS) | Whitisk gloss, high hardness, wear resistance and excellent uniform electrodeposition |
F-20 (rhodium sulfate plating solution) | Decorative, contact parts, semiconductors (MEMS) | Low resistance (specific resistance not exceeding 10 μΩ·cm), possible to make 10 μm thickness |
AQ-Ru (black ruthenium sulfate plating solution) | Decorative | Blackisk gloss |
Ruthenium sulfate plating solution | Decorative, contact parts | Whitisk gloss, high hardness and excellent wear resistance |
Rotenium (Rh-Ru alloy plating solution) | Decorative, contact parts | Whitisk gloss, high corrosion resistance and possible to make Reel-to-Reel processing |
E-Au-7 (Au-Co plating solution) | Electronic components (terminals), contact parts | Glossy film, corrosion resistance, excellent wear resistance, Co content rate (0.3 ~0.5%) |
E-Au-9 (Au-Co plating solution) | Electronic components (terminals), contact parts | Possible to make high-speed plating, glossy film, corrosion resistance, excellent wear resistance, Co content rate (0.2 ~0.5%) |
E-Au-PG (Pure Au plating solution) | Semiconductors, PWB (bonding wires) | Semi-gloss to matte film, over 99.9% gold quality in film |
F-Au-3 (strike pure Au plating solution) | Decorative, electronic components | Glossy film, excellent corrosion resistance |
MS-5 (electro Ag plating solution) | IC lead frames, discrete frames, connectors | Supports a wide range of current densities (10 to 100 A/dm2) |
- * As per products, multiple part numbers (types) are necessary for one plating. For more information, please contact us.
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