Precious Metal Plating Chemicals (Au,Ag,Rh,Ru)

Precious metal plating chemicals

Product name Application Features
H-8 (rhodium sulfate plating solution) Contact parts, semiconductors (MEMS) Maintains compressive stress, possible to make ultra-thick plating over tens micron
F-9 (rhodium sulfate plating solution) Decorative, contact parts, semiconductors (MEMS) Whitisk gloss, high hardness, wear resistance and excellent uniform electrodeposition
F-20 (rhodium sulfate plating solution) Decorative, contact parts, semiconductors (MEMS) Low resistance (specific resistance not exceeding 10 μΩ·cm), possible to make 10 μm thickness
AQ-Ru (black ruthenium sulfate plating solution) Decorative Blackisk gloss
Ruthenium sulfate plating solution Decorative, contact parts Whitisk gloss, high hardness and excellent wear resistance
Rotenium (Rh-Ru alloy plating solution) Decorative, contact parts Whitisk gloss, high corrosion resistance and possible to make Reel-to-Reel processing
E-Au-7 (Au-Co plating solution) Electronic components (terminals), contact parts Glossy film, corrosion resistance, excellent wear resistance, Co content rate (0.3 ~0.5%)
E-Au-9 (Au-Co plating solution) Electronic components (terminals), contact parts Possible to make high-speed plating, glossy film, corrosion resistance, excellent wear resistance, Co content rate (0.2 ~0.5%)
E-Au-PG (Pure Au plating solution) Semiconductors, PWB (bonding wires) Semi-gloss to matte film, over 99.9% gold quality in film
F-Au-3 (strike pure Au plating solution) Decorative, electronic components Glossy film, excellent corrosion resistance
MS-5 (electro Ag plating solution) IC lead frames, discrete frames, connectors Supports a wide range of current densities (10 to 100 A/dm2)
  • * As per products, multiple part numbers (types) are necessary for one plating. For more information, please contact us.

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