Functional Surface Finishing Chemicals (Anti-tarnish for metal)
Post-treatment chemicals for connectors and contacts
| Product name | Application | Features |
|---|---|---|
| CT-3 | Making up bath, replenishment solution (nickel sulfamate plating bath) | Maintains compressive stress, possible to make ultra-thick plating over tens micron |
| CT-3S | Seal treatment for Au (/Ni) plating (micro connectors, etc.) | High corrosion resistance (salt spray resistance), highly water-repellent, short dipping time (5 s) |
| CT-5A | Heat-resistant Ag anti-tarnish | High heat resistance, no effect on bonding properties |
| CT-3u | Anti-tarnish for Ag plating, electrolytic | More sulfidation resistance than one of CT-3 Further improved sulfidation resistance through cathodic electrolysis treatment |
| CT-88S | Rust prevention agent for two-colors of Au (/Ni) and Sn | Improves corrosion resistance of both Au (/Ni) and Sn plating surfaces in a single process, direct drying after treatment |
| TG-3 | Anti-oxidation for Sn and Sn alloys | Strong acidity, prevents oxidation (discoloration) during heat treatment |
| TG-4 | Anti-oxidation for Sn and Sn alloys | Strongly acidic, prevents oxidation (discoloration) during storage or transportation in high-temperature/high-humidity environments |
| TG-6 | Anti-oxidation for Sn and Sn alloys | Neutral, components sensitive to acids |
| TG-6P | Anti-oxidation for Sn and Sn alloys, phosphorus-free | Neutral, components sensitive to acids Sn post-treatment agent that complies with phosphorus wastewater regulations |
Post-treatment chemicals for LEDs
| Product name | Application | Features |
|---|---|---|
| CT-3 | Seal treatment for Au (/Ni) plating, anti-tarnish for Ag plating (FFC, etc.) | Our standard product High corrosion resistance (salt spray resistance), highly water-repellent, sulfidation resistance |
| CT-5A | Heat-resistant Ag anti-tarnish | High heat resistance, no effect on bonding properties |
| CT-3u | Anti-tarnish for Ag plating, electrolytic | More sulfidation resistance than one of CT-3 Further improved sulfidation resistance through cathodic electrolysis treatment |
| TG-4R | Anti-RBO* agent for Ag (* Resin Bleed Out) | High RBO performance, sulfidation resistance, no effect on bonding |
| LA-1 | Improved adhesion between Ag and silicone resin | Contains our proprietary silane coupling agent, Adhesion strength 2 to 3 times greater than when untreated, No effect on glossiness, reflectance, and wire bondability of Ag surface |
| RCA-1 | Ag recrystallization inhibitor | Suppresses changes in the glossiness of the silver plating film due to heating |
Post-treatment chemicals for power devices
| Product name | Application | Features |
|---|---|---|
| CT-3S | Prevents oxidation and improves corrosion resistance of Ni plating (heat sinks, etc.) | Suppresses solder wettability deterioration of the Ni surface, highly water-repellent |
| CT-5A | Anti-oxidation of Ni plating | Improved adhesion between the Ni surface and resin |
| WOT 3V | Improved corrosion resistance for Ni | Improved corrosion resistance for Ni plating, highly water-repellent |
Other post-treatment chemicals
| Product name | Application | Features |
|---|---|---|
| NT-1 | Prevents heat discoloration of copper components in power modules (heat sinks for IGBT modules, etc.) | Silane coupling agent, forms a thick organic film, high protection performance against heat discoloration Excellent salt spray resistance, improved adhesion to resin |
| KI-200 | Copper discoloration inhibitor (heat sinks/VCM etching springs, etc.) | High moisture resistance, for both copper and copper alloys |
| Aurum stripper 710H | Gold plating stripping | Cyanide-based additive type, fast stripping, reducing impact on base material |
Imidazole-silane (silane coupling agent)
| Product name | Application | Features |
|---|---|---|
| IM-1000 | Added to resin products or surface treatment to improve adhesion, improves resin curing, etc. | Soluble in organic solvents |
| IS-1000 | Added to resin products or surface treatment to improve adhesion, improves resin curing, etc. | Soluble in water |
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