Electro Plating Chemicals (Ni,Sn,Cu)
Nickel salts, tin salts, etc.
| Product name | Application | Features |
|---|---|---|
| Nickel sulfamate 900/1014/900HG (regular/high-purity) | Making up bath, replenishment solution (nickel sulfamate plating bath) | Maintains compressive stress, possible to make ultra-thick plating over tens micron |
| Nickel carbonate (regular/high-purity) | Catalysts, nickel salt raw materials, pigments, pH adjustment | 29% powder (wet type), excellent solubility |
| Nickel bromide 500 | Nickel sulfamate plating bath additive | 500 g/L (35% product), Anode solubilizer for sulfamic acid baths |
| Stannous sulfate | Making up bath and replenishment solution (tin plating bath) |
At least 96% stannous sulfate, powder |
| Activated stannous oxide | Making up bath and replenishment solution (tin plating bath) |
Excellent solubility, powder (wet type) |
| NSP S-200 (methanesulfonic acid tin) | High-speed plating (connectors, lead frames, etc.), Barrel plating, etc. | Organic acid tin salt, tin content 20 wt% |
| NSP B-150 (methanesulfonic acid bismuth) | High-speed plating (connectors, lead frames, etc.), Barrel plating, etc. | Organic acid bismuth solution, bismuth content 15 wt% |
| NSP A-700 (methanesulfonic acid) | High-speed plating (connectors, lead frames, etc.), Barrel plating, etc. | For Making up bath preparation and acid replenishment of organic acid plating solution |
Electric nickel/tin/copper plating chemicals
| Product name | Application | Features |
|---|---|---|
| Nickel sulfamate plating solution | For connectors, hoops, and electroforming | Mixed to order*
|
| Roughened nickel plating solution | Electronic components | Improved adhesion to resin due to the anchor effect |
| Ni-Co alloy plating solution | Electroforming (stampers), semiconductors (MEMS) | For ultra-fine plating, reducing internal stress, hardness (450Hv) |
| Ni-P alloy plating solution (E-Ni-HP-1) | Electronic components | Excellent corrosion resistance, hardness (600Hv) phosphorus content rate 10 to 13% |
| Sn-Zn alloy plating solution (T-Zalloy MS) | For racks | Matte film, spreadability and excellent post-processing |
| Copper sulfate plating solution | Electronic components | Mixed to order*
|
Nickel plating additive
| Product name | Application | Features |
|---|---|---|
| NK Nickel | Decorative, anti-corrosion, electronic components | High leveling action, high gloss and good spreadability, good throwing power to areas with low current density |
| Y Nickel UB | Decorative, anti-corrosion, electronic components | Super gloss, super-high leveling action, elegant blackish appearance and good throwing power to areas with low current density |
| Levenon LS | Decorative | Low leveling action (does not affect the shape of the material) |
| Levenon A | Decorative | Ultra-low leveling action (faithful reproduction of material pattern) |
| Y Nickel NC-P | Electronic components | Hardness (500Hv), excellent uniform electrodeposition |
| Y Nickel NC-D | Electronic components | Hardness (400Hv), excellent stress reduction effect |
| Y Nickel LSS | Electronic components | Hardness (200Hv), sulfer-free (high cforrosion resistance), excellent spreadability |
| Y Nickel LS-OY | Electronic components | Hardness at least 500 Hv, glossy appearance, low sulfur bath (good corrosion resistance) |
| Nickel pitting inhibitor UP-S | Electronic components | Preventing pits from plating film, No effect on internal stress, hardness and gloss |
Please contact us for details.
Contact Us
Inquiry to Products, Services and/or Business