Electroless Ni/Pd/Au plating process (Displacement Pd type)
Features
Compared to the conventional electroless Ni/Pd/Au (ENEPIG) process, the Pd and Au film thickness are extremely thin.
Extremely stable deposition rate.
The newly developed Displacement Pd type plating bath has excellent solution stability while maintaining a high deposition rate.
- *MTO (Metal Turn Over): The number of times the Pd metal is replenished to compensate for the amount consumed by deposition.
Ensures solderability and wire bondability at the same level as conventional Ni/Au and Ni/Pd/Au.
Main applications
- IC package substrates
- LED substrates
- Printed wiring boards
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