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Surface Finishing Chemicals
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Electroless Plating Chemicals for PWB/FPC
Electroless Plating Chemicals for Industrial component
Lead frame chemicals
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Electroless Ni/Pd/Au plating process (Reduction Pd type)
Electroless Ni/Pd/Au plating process (Displacement Pd type)
Heat-resistant copper anti-tarnish agent (AT-4)
Adhesion promoter (PA-2)
Anti-EBO (epoxy bleed out) agent (TG-4R)
Copper anti-scorch agent (OR-2)
Metal surface treatment agent (CT-3)
Surface treatment agent for power devices (CT-3S)
Improved adhesion between nickel and resin (roughened nickel plating, CT-5A)
Rhodium sulfate plating
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